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The purpose of this paper is to describe a novel methodology for predicting reliability for consumer electronics or any other hardware systems that experience a complex lifecycle environmental profile.

This Physics-of-Failure–based three-step methodology can be used to predict the degradation rate of a population using a Monte Carlo approach. The three steps include: using an empirical equation describing the degradation of a performance metric, a degradation consistency condition and a technique to account for cumulative degradation across multiple life-cycle stress conditions (e.g. temperature, voltage, mechanical load, etc.).

Two case studies are provided to illustrate the methodology including one related to repeated touch-load induced artifacts for displays.

This novel methodology can be applied to a wide range of applications from mechanical systems to electrical circuits. The results can be fed into the several stages of engineering validation to speed up product qualification.